SMD Soldering: Difference between revisions
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In contrast to the through-hole soldering technology, the surface mount technology ("surface-mounted device"/ SMD) is easier to automate, has several mechanical advantages, and it better supports the ongoing miniaturization of [[Electronic Components|electronic parts]]. Therefore it is nowadays the standard in the electronics industry. | |||
== Soldering SMD Components == | |||
The principle is that you first apply [[Material:Soldering Paste|soldering paste]] to all areas of the [[PCB]]. Then you place all parts (manually or by machine) on top. Finally you apply heat to the entire PCB and solder all parts at once. In the internet you find a lot of literature about this topic. The following external links are helpful for a first orientation. | |||
= | Normally the SMD process requires soldering paste, stencils, pick and place machines and a [[Reflow Oven|reflow oven]] (overview: https://www.youtube.com/watch?v=DYrucIWig24). However, maker friendly alternatives are available. | ||
* An overview about these techniques is available here (German): https://www.mikrocontroller.net/articles/SMD_Löten | |||
* This video shows the process for the stencil method, using a [[Hot Air Soldering Station|hot air soldering station]] as heat source: https://www.youtube.com/watch?v=qyDRHI4YeMI | |||
* This video shows a process that employs a conventional [[Soldering Iron|soldering iron]] only: https://www.elektormagazine.de/news/smds-von-hand-loten-nur-mit-mikroskop | |||
* This channel provides several soldering tipps for the manual process (German): https://www.youtube.com/watch?v=4GrQNH80oDY | |||
== Organizing Components == | |||
You could organize your SMD component stripes in [https://hackaday.com/2019/11/07/3d-printed-magazines-tame-the-smd-tape-beast/ 3D printed magazines]. | You could organize your SMD component stripes in [https://hackaday.com/2019/11/07/3d-printed-magazines-tame-the-smd-tape-beast/ 3D printed magazines]. | ||
[[Category: | [[Category:Electronics]] | ||
Latest revision as of 23:04, 11 May 2024
In contrast to the through-hole soldering technology, the surface mount technology ("surface-mounted device"/ SMD) is easier to automate, has several mechanical advantages, and it better supports the ongoing miniaturization of electronic parts. Therefore it is nowadays the standard in the electronics industry.
Soldering SMD Components
The principle is that you first apply soldering paste to all areas of the PCB. Then you place all parts (manually or by machine) on top. Finally you apply heat to the entire PCB and solder all parts at once. In the internet you find a lot of literature about this topic. The following external links are helpful for a first orientation.
Normally the SMD process requires soldering paste, stencils, pick and place machines and a reflow oven (overview: https://www.youtube.com/watch?v=DYrucIWig24). However, maker friendly alternatives are available.
- An overview about these techniques is available here (German): https://www.mikrocontroller.net/articles/SMD_Löten
- This video shows the process for the stencil method, using a hot air soldering station as heat source: https://www.youtube.com/watch?v=qyDRHI4YeMI
- This video shows a process that employs a conventional soldering iron only: https://www.elektormagazine.de/news/smds-von-hand-loten-nur-mit-mikroskop
- This channel provides several soldering tipps for the manual process (German): https://www.youtube.com/watch?v=4GrQNH80oDY
Organizing Components
You could organize your SMD component stripes in 3D printed magazines.
